SAP-a program package for three-dimensional interconnect simulation
R. Sabelka, S. Selberherr · 2002
We introduce a set of simulation programs for two- and three-dimensional analysis of interconnect structures. The SAP (smart analysis programs) simulators are based on the finite element method and can be used for highly accurate capacitance extraction, resistance calculation, transient electric and coupled electro-thermal simulations. Furthermore, the program package includes two preprocessors that support a layer-based input language and an automatic grid generator. Two application examples are given.