WASP 3: A real time signal and data processor
S.J. Hedge, I.P. Jalowiecki, R.M. Lea · 2003
The WASP (WSI Associative String Processor) project is aimed at the production of embedded wafer-scale MPC (massively parallel computer) components, with performance, size, weight, power dissipation, and reliability parameters that are far superior to those obtained using conventional technology. WASP 3 heralds the progression to the WASP experimental program into its application demonstrator phase. As the first in a family of three devices, WASP 3 will demonstrate fundamental signal and data processing operations using a WASP device. Of at least equal significance will be the demonstration of the use of an industry-standard microelectronic packaging route for WASP devices. This establishes that WASP packaging has progressed far beyond the laboratory bench, and is maturing towards end-user standards.>