80-Gbit/s MCM-C technologies for high-speed ATM switching systems
Katsuhiko Okazaki, Nobuaki Sugiura, Akio Harada, Naoaki Yamanaka, Eiji Oki · 1999
We have developed an ATM switch ceramic multichip module (MCM) that has an aluminum substrate. This MCM can support a high-density mounting and high-speed interconnection among LSI chips. Using LSI technology, ceramic-substrate technology, high-speed/high-power connector technology, and compact liquid-cooling technology, we built an 80-Gbit/s ATM switching module.