The application of test structures and test patterns to the development of radiation hardened integrated circuits :
Kenneth F. Galloway, M. G. Buehler · 1976
Government sponsored research and development on semiconduc- tor devices intended for application in radiation environ- ments often relies on test structures arranged into test patterns for device design information and process character- ization.Problems unique to a radiation environment are often analyzed using test structures such as MOS capacitors and break-out transistors.The work reviewed in this report clearly demonstrates the importance of test structures in isolating and identifying problem areas.However, the measurement methodology associated with test structures is seldom reported which makes it difficult to compare the results of different workers.Also, the work reported to date using test structures and test patterns for assessing radiation effects has involved the relatively slow-speed laboratory testing of statistically insignificant numbers of test struc- tures.Test patterns could be used by buyers of radiation hardened devices for (1) vendor selection and qualification, (2) process validation for hardness screening and hardness assurance, and (3) identification of circuit parameters crit- ical to hardness assurance.However, before this can effec- tively be done, it is necessary that standardized modular test structures be designed to permit measurement of param- eters of known importance to device hardness, that test struc- tures be measurable with high-speed integrated circuit testers so that significant numbers can be measured, and that the data reduction and analysis routines be well established.1.