A 130 nm flash+logic+analog modular technology
Albert Fazio · 2004
A 130 nm Flash+logic+analog technology has been developed specifically for the wireless communications market where low power and high-density highly integrated solutions are required to deliver new capabilities to the mobile handset business. The integration of non-volatile flash memory and digital logic is cost effectively achieved without compromise to either the flash memory density or the digital logic performance. This technology forms the silicon backbone of Intel's Personal Internet Client Architecture. A modular platform approach makes process modules available to the designer who can choose the level of integration required for any specific product.