Thermal management of a high power multichip module in a space environment
Sharon A. Coogan, Jason Maynard, Mark Stoklosa, Duane A. Gilmour · AIP conference proceedings · 1996
As multichip module (MCM) power increases, thermal management becomes more challenging. A radiation hardened, 32 bit (RH‐32) computer multichip module (MCM) is being developed under the MILSATCOM program using aluminum nitride (AlN) as the MCM package material. This state‐of‐the‐art use of AlN provides excellent heat spreading and thermal management. The result is an MCM virtually without hot‐spots. Unfortunately, use of AlN complicates a number of the standard MCM assembly and rework processes. This paper will discuss the use of AlN, present the results of a detailed thermal analysis and the work done to fine tune MCM assembly and rework processes.