Routing in the Third Dimension
Naveed A. Sherwani, Siddharth Bhingarde, Anand Panyam · 1995
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area