On the role of diamond, HTS, and a novel MCM topology in the development of multichip power modules (MCPMS) for space applications
Kraig J. Olejniczak, K.C. Burgers, Simon S. Ang, Ajay P. Malshe, Hameed A. Naseem, W. Duane Brown · AIP conference proceedings · 1996
This paper presents the University of Arkansas High Density Electronics Center’s (HiDEC) most recent developments in diamond processing, high‐temperature superconductors (HTS), and MCM power distribution technologies. Each of these technologies not only can be used for conventional MCMs, but are also candidate technologies for an ongoing development effort of highly integrated, intelligent, high‐power solid‐state power controllers, hereafter termed, multichip power modules (MCPMs).