On-chip interconnects for next generation system-on-chips
André Brinkmann, Jörg-Christian Niemann, I. Hehemann, Dominik Langen, Mario Porrmann, Ulrich Rückert · 2002
Today's deep submicron fabrication technologies enable design engineers to put an impressive number of components like microprocessors, memories, and interfaces on a single microchip. With the emergence of 100 nm processes, billions of transistors can be integrated on one die and form a parallel system, consisting of thousands of components. To handle this impressive number of components, it is important to provide a communication infrastructure which is able to scale with the capabilities of upcoming fabrication technologies and which provides the foundation for efficient on-chip communication protocols. This paper addresses the architectural requirements which are coupled with the transfer of well known techniques from parallel computers onto the design of SoCs and proposes an on-chip architecture which is based on active switch boxes. We show that this architecture is able to fill the existing design gap between an efficient use of the design space and the design complexity, with reasonable resource requirements.