An advanced MCM associative string processor
I.P. Jalowiecki, R.M. Lea, D.J. Pedder · 2002
The HASP4001 hybrid wafer scale integration (HWSI) device, optimized for massively parallel processing, is described. It is a large-area silicon-on-silicon multichip module (MCM-D). The design is based on the experience gained in the implementation of a previous-generation massively parallel computer. It is shown that the resulting module is a significantly more cost-effective system component, minimizing board area and enhancing performance. It is shown that the HWSI incorporates many of the same techniques adopted for the monolithic WSI version, ensuring reliable implementation suitable for medium scale production.>