Design and implementation of the POWER5/spl trade/ microprocessor

J. Clabes, Joshua Friedrich, M. Sweet, J. DiLullo, Sam Chu, D. Plass, J. L. Dawson, P. Muench, Larry Powell, M. Floyd, Balaram Sinharoy, M. Lee, Michael Goulet, James D. Wagoner, Nicole Schwartz, Steve Runyon, G.M. Gorman, Phillip J. Restle, Reddieswara Naidu Kalla, Joseph McGill · 2004

POWER5/sup TM/ is the next generation of IBM's POWER microprocessors. This design, sets a new standard of server performance by incorporating simultaneous multithreading (SMT), an enhanced distributed switch and memory subsystem supporting 164w SMP, and extensive RAS support. First pass hardware using IBM's 130nm silicon-on-insulator technology operates above 1.5GHz at 1.3V. POWER5's dual-threaded SMT creates up to two virtual processors per core, improving execution unit utilization and masking memory latency. Although a simplistic SMT implementation promised /spl sim/20% performance improvement, resizing critical microarchitectural resources almost doubles in many cases the SMT performance benefit at a 24% area. Implementing these microarchitectural enhancements posed challenges in meeting the chip's frequency, area, power, and thermal targets.

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